MCP23016 查看數據表（PDF） - Microchip Technology

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MCP23016

16-Bit I2C™ I/O Expander

Microchip Technology 

MCP23016

28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

NOTE 1

123

b

E

E1

e

h

α

h

φ

c

A

A2

L

A1

L1

β

Units

MILLMETERS

Dimension Limits MIN

NOM

MAX

Number of Pins

N

28

Pitch

e

1.27 BSC

Overall Height

A

–

–

2.65

Molded Package Thickness

A2

2.05

–

–

Standoff §

A1

0.10

–

0.30

Overall Width

E

10.30 BSC

Molded Package Width

E1

7.50 BSC

Overall Length

D

17.90 BSC

Chamfer (optional)

h

0.25

–

0.75

Foot Length

L

0.40

–

1.27

Footprint

L1

1.40 REF

Foot Angle Top

φ

0°

–

8°

Lead Thickness

c

0.18

–

0.33

Lead Width

b

0.31

–

0.51

Mold Draft Angle Top

α

5°

–

15°

Notes:

Mold Draft Angle Bottom

β

5°

–

15°

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-052B

© 2007 Microchip Technology Inc.

DS20090C-page 29

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