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IDT7025S17GGI(2012) 查看數據表(PDF) - Integrated Device Technology

零件编号
产品描述 (功能)
生产厂家
IDT7025S17GGI
(Rev.:2012)
IDT
Integrated Device Technology IDT
IDT7025S17GGI Datasheet PDF : 22 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
IDT7025S/L
High-Speed 8K x 16 Dual-Port Static RAM
Military, Industrial and Commercial Temperature Ranges
AC Electrical Characteristics Over the
Operating Temperature and Supply Voltage(5)
7025X15
Com'l Only
7025X17
Com'l Only
7025X20
Com'l, Ind
& Military
7025X25
Com'l &
Military
Symbol
Parameter
Min. Max. Min. Max. Min. Max. Min. Max. Unit
WRITE CYCLE
tWC
Write Cycle Time
tEW
Chip Enable to End-of-Write(3)
tAW
Address Valid to End-of-Write
tAS
Address Set-up Time(3)
tWP
Write Pulse Width
15
____
17
____
20
____
25
____
ns
12
____
12
____
15
____
20
____
ns
12
____
12
____
15
____
20
____
ns
0
____
0
____
0
____
0
____
ns
12
____
12
____
15
____
20
____
ns
tWR
Write Recovery Time
0
____
0
____
0
____
0
____
ns
tDW
tHZ
tDH
tWZ
tOW
tSWRD
tSPS
Data Valid to End-of-Write
Output High-Z Time(1,2)
Data Hold Time(4)
Write Enable to Output in High-Z(1,2)
Output Active from End-of-Write(1,2,4)
SEM Flag Write to Read Time
SEM Flag Contention Window
10
____
10
____
15
____
15
____
ns
____
10
____
10
____
12
____
15
ns
0
____
0
____
0
____
0
____
ns
____
10
____
10
____
12
____
15
ns
0
____
0
____
0
____
0
____
ns
5
____
5
____
5
____
5
____
ns
5
____
5
____
5
____
5
____
ns
2683 tbl 13a
7025X35
Com'l &
Military
7025X55
Com'l, Ind
& Military
7025X70
Military Only
Symbol
Parameter
Min. Max. Min. Max. Min. Max. Unit
WRITE CYCLE
tWC
Write Cycle Time
tEW
Chip Enable to End-of-Write(3)
35
____
55
____
70
____
ns
30
____
45
____
50
____
ns
tAW
Address Valid to End-of-Write
tAS
Address Set-up Time(3)
30
____
45
____
50
____
ns
0
____
0
____
0
____
ns
tWP
Write Pulse Width
tWR
Write Recovery Time
25
____
40
____
50
____
ns
0
____
0
____
0
____
ns
tDW
Data Valid to End-of-Write
15
____
30
____
40
____
ns
tHZ
Output High-Z Time(1,2)
____
15
____
25
____
30
ns
tDH
Data Hold Time(4)
0
____
0
____
0
____
ns
tWZ
Write Enable to Output in High-Z(1,2)
____
15
____
25
____
30
ns
tOW
Output Active from End-of-Write(1,2,4)
0
____
0
____
0
____
ns
tSWRD
SEM Flag Write to Read Time
5
____
5
____
5
____
ns
tSPS
SEM Flag Contention Window
5
____
5
____
5
____
ns
NOTES:
2683 tbl 13b
1. Transition is measured 0mV from Low or High-impedance voltage with the Output Test Load (Figure 2).
2. This parameter is guaranteed by device characterization, but is not production tested.
3. To access RAM, CE = VIL, UB or LB = VIL, SEM = VIH. To access semaphore, CE = VIH or UB & LB = VIH, and SEM = VIL. Either condition must be valid for the
entire tEW time.
4. The specification for tDH must be met by the device supplying write data to the RAM under all operating conditions. Although tDH and tOW values will vary over voltage
and temperature, the actual tDH will always be smaller than the actual tOW.
5. 'X' in part number indicates power rating (S or L).
61.412

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